In earphone manufacturing, precision glue dispensing is a critical step that directly affects product quality and production efficiency. Manual dispensing often leads to issues such as inconsistent glue volume, misalignment, and unstable quality control.
The dispensing equipment used in this project consists of a dispensing head, conveyor system, PLC control unit, and vision inspection system. The high-precision nozzle ensures that glue is accurately applied to the designated position on the earphone components. The vision system performs real-time monitoring and correction, ensuring uniformity and stability throughout the dispensing process.
This automated dispensing system significantly improves production efficiency and ensures consistent quality for mass earphone manufacturing.
Main Control Brand: Omron
Applicable Process: Earphone Assembly
I/O Configuration: Approx. 80 digital I/O points
Annual Usage: 3 million units
The solution integrates our digital I/O modules with the Omron PLC to establish a fully automated dispensing workflow. The PLC continuously collects signals from key sensors, including position sensors, glue-level detectors, and workpiece presence sensors, ensuring dispensing accuracy and overall stability.
The digital I/O module controls the dispensing head, conveyor movement, indicator lights, and safety mechanisms, delivering a coordinated and reliable automation setup.
The combination of high-precision sensors and the vision inspection system ensures accurate glue placement, preventing issues such as missing glue, excess glue, or misalignment.
The Omron PLC and digital I/O structure deliver fast response, strong noise immunity, and highly stable performance—meeting the high-speed cycle requirements of 3C assembly lines.
Designed to support an annual production capacity of 3 million units, the solution maintains continuous and efficient operation on high-volume manufacturing lines.
Modular design allows for future upgrades—such as adding new inspection points or integrating additional workstations—making it adaptable to evolving production needs.
The overall system adopts a three-layer structure:
Information Layer: Production data, equipment status, and upper-level system connectivity
Control Layer (PLC): Logic control, process scheduling, and real-time data processing
Drive & Execution Layer (Remote I/O, Actuators, Sensors): Handles dispensing actions, motion control, detection, and protection mechanisms
This layered architecture ensures modularity, scalability, and ease of maintenance.
High Operational Stability – Reliable performance even under intensive production conditions
Easy Installation & Maintenance – Modular hardware simplifies servicing
Fast Fault Diagnosis – System supports multi-level error monitoring for improved user experience
Improved Production Efficiency – Ensures uniform dispensing quality and increases overall yield
In earphone manufacturing, precision glue dispensing is a critical step that directly affects product quality and production efficiency. Manual dispensing often leads to issues such as inconsistent glue volume, misalignment, and unstable quality control.
The dispensing equipment used in this project consists of a dispensing head, conveyor system, PLC control unit, and vision inspection system. The high-precision nozzle ensures that glue is accurately applied to the designated position on the earphone components. The vision system performs real-time monitoring and correction, ensuring uniformity and stability throughout the dispensing process.
This automated dispensing system significantly improves production efficiency and ensures consistent quality for mass earphone manufacturing.
Main Control Brand: Omron
Applicable Process: Earphone Assembly
I/O Configuration: Approx. 80 digital I/O points
Annual Usage: 3 million units
The solution integrates our digital I/O modules with the Omron PLC to establish a fully automated dispensing workflow. The PLC continuously collects signals from key sensors, including position sensors, glue-level detectors, and workpiece presence sensors, ensuring dispensing accuracy and overall stability.
The digital I/O module controls the dispensing head, conveyor movement, indicator lights, and safety mechanisms, delivering a coordinated and reliable automation setup.
The combination of high-precision sensors and the vision inspection system ensures accurate glue placement, preventing issues such as missing glue, excess glue, or misalignment.
The Omron PLC and digital I/O structure deliver fast response, strong noise immunity, and highly stable performance—meeting the high-speed cycle requirements of 3C assembly lines.
Designed to support an annual production capacity of 3 million units, the solution maintains continuous and efficient operation on high-volume manufacturing lines.
Modular design allows for future upgrades—such as adding new inspection points or integrating additional workstations—making it adaptable to evolving production needs.
The overall system adopts a three-layer structure:
Information Layer: Production data, equipment status, and upper-level system connectivity
Control Layer (PLC): Logic control, process scheduling, and real-time data processing
Drive & Execution Layer (Remote I/O, Actuators, Sensors): Handles dispensing actions, motion control, detection, and protection mechanisms
This layered architecture ensures modularity, scalability, and ease of maintenance.
High Operational Stability – Reliable performance even under intensive production conditions
Easy Installation & Maintenance – Modular hardware simplifies servicing
Fast Fault Diagnosis – System supports multi-level error monitoring for improved user experience
Improved Production Efficiency – Ensures uniform dispensing quality and increases overall yield
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